Transparent material cutting with ultrafast laser and beam optics
US9687936B2 · kind B2 · utility
5Cited by
44References
41Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2014 |
| Grant date | Jun 27, 2017 |
| Priority date | — |
| Expiry date | Oct 31, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P40/57
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A system for laser drilling of a material includes a pulsed laser configured to produce a pulsed laser beam having a wavelength less than or equal to about 850 nm, the wavelength selected such that the material is substantially transparent at this wavelength. The system further includes an optical assembly positioned in the beam path of the laser, configured to transform the laser beam into a laser beam focal line oriented along the beam propagation direction, on a beam emergence side of the optical assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.