Heating platform and 3D printing apparatus
US9688026B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 12, 2014 |
| Grant date | Jun 27, 2017 |
| Priority date | — |
| Expiry date | Nov 29, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B1/023
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A heating platform including a substrate, a heating plate, a conducting plate and a temperature sensing element is provided. The substrate has a first surface for forming a three dimensional (3D) object and an opposite second surface. The heating plate is attached to the second surface of the substrate to heat the substrate. The conducting plate is attached to the heating plate, and the heating plate is coved between the substrate and the conducting plate, wherein the area of the conducting plate is smaller than the area of the substrate, and an end of the conducting plate extends to the outer of the heating plate. The temperature sensing element is disposed at the end of the conducting plate extending to the outer of the heating plate to sense the temperature of the substrate through the conducting plate. A 3D printing apparatus including the heating platform aforementioned is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.