Apparatus and method for forming holes in glass substrate
US9688563B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2016 |
| Grant date | Jun 27, 2017 |
| Priority date | — |
| Expiry date | Mar 1, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB26D7/01
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for forming holes in a glass substrate, includes a laser source that irradiates a laser beam on a first surface of the glass substrate, and a base plate on which a second surface of the glass substrate, opposite to the first surface, is placed. The base plate includes a recessed area in a central part thereof, and supports arranged within the recessed area to support the glass substrate. At least a part of the supports is arranged in a lattice shape within a plane approximately perpendicular to a direction in which the supports extend. One support and another adjacent support closest to the one support, amongst the supports arranged in the lattice shape, are arranged at an interval that is shorter than 30 mm, and the supports have a height that is higher than 70 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.