Silicone resin composition for optical semiconductors
US9688819B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2014 |
| Grant date | Jun 27, 2017 |
| Priority date | — |
| Expiry date | Jul 30, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/854
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Addition-crosslinkable silicone resin compositions containing a branched organopolysiloxane bearing each of Si—H groups, alkenyl groups, and aryl groups, and also containing blocks of linear organopolysiloxane free of Si—H and alkenyl groups with a chain length of at least three siloxy groups, and further bearing at least one aryl group, serve as excellent potting compositions for electronic devices, particularly LEDs, with high refractive index and optical transmittance, and wide processing latitude.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.