Organopolysiloxane, curable silicone composition, cured product thereof, and optical semiconductor
US9688822B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2013 |
| Grant date | Jun 27, 2017 |
| Priority date | — |
| Expiry date | Oct 23, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/854
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane represented by a specific average unit formula, (B) an optional straight-chain organopolysiloxane having at least two alkenyl groups and not having any silicon-bonded hydrogen atoms in a molecule, (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, and (D) a hydrosilylation reaction catalyst. The curable silicone composition has high reactivity and forms a cured product with low gas permeability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.