Patent · US Active

Systems and methods for applying metallic laminates to cables

US9691524B2 · kind B2 · utility

0Cited by
13References
17Claims
0Family size

Assignee

Inventor

Key dates

Filing dateDec 8, 2014
Grant dateJun 27, 2017
Priority date
Expiry dateDec 8, 2034

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02A30/14
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A laminated cable includes a metal laminate surrounding a cable core having first and second ends. Solder is applied adjacent the ends of the laminate, and is heated and subsequently cooled to form a metal seal. The solder can be melted in a plastic jacketing extruder as the extruder applies a plastic jacket over the metal laminate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.