Split chip solution for die-to-die serdes
US9692448B1 · kind B1 · utility
4Cited by
6References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2016 |
| Grant date | Jun 27, 2017 |
| Priority date | — |
| Expiry date | Sep 22, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L7/0008
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
An SoC integrated circuit package is provided in which the analog components of a SerDes for an SoC die in the SoC integrated circuit package are segregated into a SerDes interface die in the SoC integrated circuit package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.