Heat management and removal assemblies for semiconductor devices
US9693487B2 · kind B2 · utility
4Cited by
11References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 6, 2015 |
| Grant date | Jun 27, 2017 |
| Priority date | — |
| Expiry date | Mar 20, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20254
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This patent disclosure describes heat management and removal assemblies for electronic devices that generate heat during use. The disclosed assemblies are particularly useful for cooling insulated gate bipolar transistors (IGBTs). The disclosed assemblies provide a low-resistance parallel cooling circuit for efficiently delivering coolant to one or more electronic devices. The disclosed parallel cooling circuits and assembly designs reduce the pump power required to deliver coolant to one or more electronic devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.