Method of joining cooling component
US9694433B2 · kind B2 · utility
0Cited by
2References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2016 |
| Grant date | Jul 4, 2017 |
| Priority date | — |
| Expiry date | Jun 29, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10409
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A disclosed method of joining a cooling component includes joining an electronic component and a spherical shaped bottom plate of a cooling component to each other by pressing the bottom plate against the electronic component, while providing a thermal bonding material between the bottom plate and the electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.