Wall thickness compensation during laser orifice drilling
US9694446B2 · kind B2 · utility
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2References
40Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2014 |
| Grant date | Jul 4, 2017 |
| Priority date | — |
| Expiry date | May 24, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/70
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Methods and systems for drilling precise orifices in a wall of non-uniform thickness are provided. In one aspect, a thickness profile of at least a portion of the wall is created and the wall is irradiated with at least one laser beam to ablate a portion of the wall to thereby form an orifice in the wall. During the irradiation, one or more parameters of the least one laser beam are adjusted one or more times in accordance with the thickness profile to compensate for the non-uniform thickness of the wall.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.