Thermal conductivity measurement apparatus and related methods
US9696270B1 · kind B1 · utility
35Cited by
2References
8Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 9, 2014 |
| Grant date | Jul 4, 2017 |
| Priority date | — |
| Expiry date | Sep 24, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K7/186
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for thermal conductance measurement includes a first heater assembly having a beam, a platen disposed at an end of the beam, and a heating element and a Resistance Temperature Device (RDT) disposed on the platen. The embodiment further includes a second heater assembly having a second beam, a second platen disposed at an end of the second beam, and a second heating element and a second Resistance Temperature Device (RDT) disposed on the platen. A test rig is also included, and the first heater and second heater assembly are mated to the test rig and separated by a gap length.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.