Patent · US Active

Three-dimensional (3D) photonic chip-to-fiber interposer

US9696498B2 · kind B2 · utility

1Cited by
4References
23Claims
0Family size

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Key dates

Filing dateMay 4, 2015
Grant dateJul 4, 2017
Priority date—
Expiry dateMay 4, 2035

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG02B6/423
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A method of fabricating an optical coupling device, comprising forming a waveguide mask layer on a substrate platform, wherein the waveguide mask layer comprises an array of openings comprising a first end and a second end opposite to the first end, immersing the substrate platform into a salt melt comprising ions to form an array of waveguides in the substrate platform through an ion diffusion process, and controlling a rate of immersion such that a diffusion depth of the ions varies as a function of a distance in a direction from the first end to the second end, wherein the array of waveguides extends in the direction from the first end to the second end.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.