Patent · US Active

Hinge having multiple degrees of freedom

US9696754B2 · kind B2 · utility

1Cited by

30References

17Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Russell S. Aoki · Tacoma, US
Jeff Ku · Taipei, TW
Sheng-Chao Lin · Taipei, TW

Key dates

Filing date	Mar 26, 2014
Grant date	Jul 4, 2017
Priority date	—
Expiry date	Jun 25, 2034

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/24
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

Techniques for forming a hinge are described herein. The hinge is to couple a first housing of a computing device and a second housing of the computing device. The hinge is to cause the first housing to have three degrees of freedom in movement from the second housing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.