Resin package and light emitting device
US9698312B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2014 |
| Grant date | Jul 4, 2017 |
| Priority date | — |
| Expiry date | Dec 17, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/49107
Abstract
A resin package includes a molded resin housing, a first lead, and a second lead. The molded resin housing includes a cavity open upward. The cavity includes an inner surface. The inner surface includes a curved portion and a stepped portion provided on a lower side of the curved portion. The first lead and the second lead are provided in a bottom portion of the cavity such that at least a part of the first lead and the second lead is exposed from the molded resin housing. The first lead includes an elevated portion on which a light emitting element is mounted. An upper surface of the elevated portion is provided higher than an upper end portion of the stepped portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.