Pressure sensitive adhesive film
US9698374B2 · kind B2 · utility
4Cited by
1References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2015 |
| Grant date | Jul 4, 2017 |
| Priority date | — |
| Expiry date | Jan 1, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2423/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present application provides a pressure-sensitive adhesive film, an organic electronic device including the same and a method of manufacturing an organic electronic device using the same. The present application provides the pressure-sensitive adhesive film which forms a structure effectively blocking water or oxygen from penetrating into an organic electronic device from the outside, and has excellent mechanical properties such as handleability, formability or the like and transparency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.