Implementing simultaneously connecting of multiple devices in a multi-tiered, multi-directional, enhanced tolerance system with mechanical support structures
US9699903B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2015 |
| Grant date | Jul 4, 2017 |
| Priority date | — |
| Expiry date | Jan 1, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49828
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus are provided for implementing simultaneously connecting of multiple devices in a multi-tiered, multi-directional, enhanced tolerance system with mechanical support structures. A main system planar assembly and an elevated planar assembly share a direct connection provided by a plurality of connectors with no cables. A mechanical support bracket is attached to a top surface of the main system planar assembly positioning and supporting the elevated planar assembly spaced appropriately for accurately connecting respective connectors with respective chassis connectors. The elevated planar assembly includes a stiffening component to facilitate proper spacing between upper and lower levels of respective connectors and tool-less insertion and extraction of the elevated planar assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.