Formulated resin compositions for flood coating electronic circuit assemblies
US9699917B2 · kind B2 · utility
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36References
23Claims
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Key dates
| Filing date | May 31, 2014 |
| Grant date | Jul 4, 2017 |
| Priority date | — |
| Expiry date | Jan 8, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09872
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Formulated resin systems containing polymeric flood coat compositions are provided herein and characterized by having an initial mix thixotropic index from 1 to 5, and a gel time from 5 to 15 minutes such that when cured the compositions provide a Shore hardness from 15 A to 90 A, a thickness on horizontal surfaces from 20 mils to 75 mils, and a thickness on vertical surfaces from 4 mils to 20 mils. Electronic circuit assemblies flood coated with such formulated resin systems, and methods for protecting and supporting said assemblies, are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.