Fluid ejection chip including hydrophilic and hydrophopic surfaces and methods of forming the same
US9701119B2 · kind B2 · utility
0Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2014 |
| Grant date | Jul 11, 2017 |
| Priority date | — |
| Expiry date | Jun 12, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D5/08
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A fluid ejection chip and associated methods of forming are disclosed. According to an exemplary embodiment, the fluid ejection chip comprises a substrate, a flow feature layer, and a nozzle layer. The flow feature layer is disposed over the substrate and has an exposed hydrophilic surface layer with an ink contact angle of about 80 degrees. The nozzle layer is disposed over the flow feature layer and has a thickness of about 4 microns to about 8 microns and an exposed hydrophobic surface layer having an ink contact angle of about 115 degrees.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.