Package structure including a cavity coupled to an injection gas channel composed of a permeable material
US9701533B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 11, 2015 |
| Grant date | Jul 11, 2017 |
| Priority date | — |
| Expiry date | Nov 11, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/11
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A packing structure including:a cap secured to at least one first substrate and forming at least one cavity between the cap and the first substrate;a layer of at least one first material permeable to a gas, arranged in the cap and/or in the first substrate and/or at the interface between the cap and the first substrate, and forming at least one part of a wall of the cavity;a portion of at least one second material non-permeable to said gas, the thickness of which is higher than or equal to that of the layer of the first material, and surrounding at least one first part of the layer of the first material forming said part of the wall of the cavity;an aperture passing through the cap or the first substrate and opening onto or into said part of the layer of the first material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.