Methods of grinding semiconductor nanocrystal polymer composite particles
US9701898B2 · kind B2 · utility
2Cited by
1References
22Claims
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Key dates
| Filing date | Aug 7, 2014 |
| Grant date | Jul 11, 2017 |
| Priority date | — |
| Expiry date | Sep 2, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K11/70
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A method of grinding a semiconductor nanocrystal-polymer composite, the method including obtaining a semiconductor nanocrystal-polymer composite including a semiconductor nanocrystal and a first polymer, contacting the semiconductor nanocrystal-polymer composite with an inert organic solvent; and grinding the semiconductor nanocrystal-polymer composite in the presence of the inert organic solvent to grind the semiconductor nanocrystal-polymer composite.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.