Electroless copper plating compositions
US9702046B2 · kind B2 · utility
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6References
6Claims
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Key dates
| Filing date | Jan 12, 2016 |
| Grant date | Jul 11, 2017 |
| Priority date | — |
| Expiry date | Jan 12, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/422
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Electroless copper plating baths include alternative reducing agents to the conventional reducing agents currently used in the electroless plating industry. The electroless copper baths are stable and deposit a salmon bright copper deposit on substrates. Exclusion of many environmentally unfriendly conventional reducing agents enables environmentally friendly electroless copper plating baths.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.