Reducing diffraction effects on an ablated surface
US9703166B2 · kind B2 · utility
2Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2015 |
| Grant date | Jul 11, 2017 |
| Priority date | — |
| Expiry date | Oct 23, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/57
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method is provided for laser ablation that reduces or eliminates a diffraction effect produced by damage to a surface from which an ablated material is removed. The method includes at least one of reducing the amount of surface damage produced and altering the damage structure produced such that it is irregular.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.