Substrate processing apparatus
US9703199B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 7, 2014 |
| Grant date | Jul 11, 2017 |
| Priority date | — |
| Expiry date | Nov 29, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67225
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of processing a substrate in a substrate processing apparatus that is arranged adjacent to an exposure device and includes first, second and third processing units, includes forming a photosensitive film on the substrate by said first processing unit before exposure processing by said exposure device and applying washing processing to the substrate by supplying a washing liquid to the substrate in said second processing unit after the formation of said photosensitive film and before the exposure processing. The method also includes applying drying processing to the substrate in said second processing unit after the washing processing by said second processing unit and before the exposure processing and applying development processing to the substrate by said third processing unit after the exposure processing. Applying the drying processing to the substrate includes the step of supplying an inert gas onto the substrate, to which the washing liquid is supplied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.