Fastenerless hinge which enables thin form factor low cost design
US9703327B2 · kind B2 · utility
4Cited by
37References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2015 |
| Grant date | Jul 11, 2017 |
| Priority date | — |
| Expiry date | Aug 8, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/16
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure includes a fastenerless hinge system which enables a thin form factor low cost design. A hinge system described herein may include a hinge bracket and a hinge wing. The hinge bracket includes an elevated portion thereby providing a hollow region and one or more spring tabs. The hinge wing is slidably coupled to the hinge bracket through the hollow portion. Advantageously, a hinge system consistent with the present disclosure does not include fasteners such that the “Z” height of the computing device may be minimized in addition to reducing costs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.