Stereo vision measurement system and method
US9704232B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2015 |
| Grant date | Jul 11, 2017 |
| Priority date | — |
| Expiry date | Oct 22, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N2013/0081
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for automatic, stereo vision based, in-line solder ball height and substrate coplanarity inspection includes providing an imaging setup together with an imaging processor for reliable, in-line solder ball height measurement. The imaging set up includes a pair of cameras mounted at two opposing angles with ring lighting around each camera lens, which allows the capture of two images of an electronics package in parallel. The lighting generates features on solder balls located on a substrate of the electronics package, which are then used to determine height. Specifically, points with the same intensity on each solder ball surface are grouped, which allows for the formation of curves, also known as iso-contours, which are then matched between the two views. An optimized triangulation is then performed to determine the height of each one of the solder balls.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.