Non-planar inductive electrical elements in semiconductor package lead frame
US9704639B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 7, 2014 |
| Grant date | Jul 11, 2017 |
| Priority date | — |
| Expiry date | Nov 7, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to non-planar inductive electrical elements in semiconductor package lead frames. A non-planar inductive element is formed from a lead frame in a semiconductor package. The semiconductor package also includes at least one semiconductor die coupled to the lead frame. The non-planar inductive element could be formed by deforming portions of a patterned planar lead frame blank to form the non-planar inductive element in a deformed lead frame blank. The deformed lead frame blank and the at least one semiconductor die could then be packaged into a semiconductor package. A setting tool could be used to deform the lead frame blank. A configurable lead frame blank could be configurable into any of a variety of inductive elements, through interconnection of lead frame segments using wire bonds, for example.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.