Flip-chip mounted semiconductor device
US9704771B2 · kind B2 · utility
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3Claims
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Assignee
Inventors
Key dates
| Filing date | Oct 29, 2015 |
| Grant date | Jul 11, 2017 |
| Priority date | — |
| Expiry date | Oct 29, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/92125
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a flip-chip mounted semiconductor device in which a crack is less likely to develop. Flip chip mounting is carried out under the condition that no oxide film exists on the scribe region so as to eliminate the interface between the oxide film that remains on the scribe region and the silicon substrate from which a crack may develop. As a result, the circuit board, the encapsulant, and the silicon substrate are stacked at an end portion of the semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.