Methods and applications of non-planar imaging arrays
US9704908B2 · kind B2 · utility
30Cited by
77References
17Claims
0Family size
Assignee
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Key dates
| Filing date | Jul 29, 2015 |
| Grant date | Jul 11, 2017 |
| Priority date | — |
| Expiry date | Jul 29, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/803
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
System, devices and methods are presented that provide an imaging array fabrication process method, comprising fabricating an array of semiconductor imaging elements, interconnecting the elements with stretchable interconnections, and transfer printing the array with a pre-strained elastomeric stamp to a secondary non-planar surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.