Avalanche photodiode and manufacturing method thereof
US9705023B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2016 |
| Grant date | Jul 11, 2017 |
| Priority date | — |
| Expiry date | Aug 11, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/547
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An avalanche photodiode includes a GeOI substrate; an I—Ge absorption layer configured to absorb an optical signal and generate a photo-generated carrier; a first p-type SiGe layer, a second p-type SiGe layer, a first SiGe layer, and a second SiGe layer, where a Si content in any one of the SiGe layers is less than or equal to 20%; a first SiO2 oxidation layer and a second SiO2 oxidation layer; a first taper type silicon Si waveguide layer and a second taper type silicon Si waveguide layer; a heavily-doped n-type silicon Si multiplication layer; and anode electrodes and a cathode electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.