Method for producing a plurality of optoelectronic semiconductor chips, and optoelectronic semiconductor chip

US9705058B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Norwin von Malm · Nittendorf, DE
• Andreas Plö;l · Regensburg, DE

Key dates

• Filing date: May 28, 2014
• Grant date: Jul 11, 2017
• Expiry date: May 28, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/0364

Abstract

An optoelectronic semiconductor chip includes a semiconductor body that has a semiconductor layer sequence and at least one opening that extends through a second semiconductor layer into a first semiconductor layer. The chip also includes a support, which includes at least one recess, and a metallic connecting layer between the semiconductor body and the support. The metallic connecting layer includes a first region and a second region. The first region is connected to the first semiconductor layer in an electrically conductive manner through the opening and the second region is connected to the second semiconductor layer in an electrically conductive manner. A first contact is connected to the first region in an electrically conductive manner through the recess or a second contact is connected to the second region in an electrically conductive manner through the recess.