L-bending PCB
US9706645B2 · kind B2 · utility
0Cited by
17References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 7, 2015 |
| Grant date | Jul 11, 2017 |
| Priority date | — |
| Expiry date | Aug 10, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10553
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A L-Bending PCB includes a straight portion and a bending portion connecting to the straight portion, the straight portion has a metal substrate bottom, an insulation layer, a conductive layer and a protective layer. The insulation layer is disposed on a partial surface of the metal substrate bottom, the conductive layer is disposed on the insulation layer and the protective layer is disposed on the conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.