Cooling system for high density heat loads
US9706685B2 · kind B2 · utility
2Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2012 |
| Grant date | Jul 11, 2017 |
| Priority date | — |
| Expiry date | Sep 18, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20836
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A pumped refrigerant cooling system having multiple pumping units for providing working fluid to a load to enable cooling of a space via the load. The pumped refrigerant cooling system operates the pumping units at less than capacity. When a pumping unit is deactivated, the output of the remaining pumping units is increased to maintain fluid flow.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.