Electronic module produced by sequential fixation of the components
US9706694B2 · kind B2 · utility
0Cited by
35References
3Claims
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Key dates
| Filing date | Apr 25, 2013 |
| Grant date | Jul 11, 2017 |
| Priority date | — |
| Expiry date | Apr 25, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53174
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A production line for producing electronic modules including a printed-circuit board, at least one first-type component, and at least one second-type component, wherein the production line includes a unit for putting the first-type component in place, a general heating unit for melting a solder placed between the at least one first-type component and the circuit, a unit for putting the second-type component in place, and a local heating unit for melting a solder placed between the at least one second-type component and the circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.