Polishing pad
US9707663B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jan 30, 2012 |
| Grant date | Jul 18, 2017 |
| Priority date | — |
| Expiry date | Sep 29, 2033 |
Classification
- Technology area (CPC D)Textiles; Paper
- CPC primaryD06N2205/24
- WIPO fieldOther consumer goods
- WIPO sectorOther fields
Abstract
A polishing pad is provided with a compression elastic modulus of 0.17 MPa or more and 0.32 MPa or less produced by preparing a nonwoven fabric formed of bundles of ultrafine fibers with an average monofilament diameter of 3.0 μm or more and 8.0 μm or less, preparing a polishing pad base by impregnating the nonwoven fabric with a polyurethane based elastomer in an amount of 20 mass % or more and 50 mass % or less relative to the mass of the polishing pad base, and laminating the polishing pad base with a porous polyurethane layer containing wet-solidified polyurethane as primary component which has openings with an average opening diameter of 10 μm or more and 90 μm or less in its surface to serve as polishing surface layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.