Patent · US Active

Printhead die

US9707753B2 · kind B2 · utility

0Cited by

19References

18Claims

0Family size

Assignee

HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. · US

Inventors

Chien-Hua Chen · Corvallis, US
Michael W. Cumbie · Albany, US
Silam J. Choy · Corvallis, US

Key dates

Filing date	Jun 17, 2013
Grant date	Jul 18, 2017
Priority date	—
Expiry date	Jun 17, 2033

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB41J2202/20
WIPO fieldTextile and paper machines
WIPO sectorMechanical engineering

Abstract

In one example, a printhead die includes a structure having a thickness 100 μm or less and a ratio of length to width of at least 50 and containing, within its thickness, multiple fluid ejectors and multiple fluid chambers each near an ejector and each having an inlet through which printing fluid may enter the chamber and an outlet through which printing fluid may be ejected from the chamber.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.