Micromachined ultra-miniature piezoresistive pressure sensor and method of fabrication of the same
US9708175B2 · kind B2 · utility
1Cited by
2References
20Claims
0Family size
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Key dates
| Filing date | Oct 13, 2015 |
| Grant date | Jul 18, 2017 |
| Priority date | — |
| Expiry date | Oct 13, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/47
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of fabrication of one or more ultra-miniature piezoresistive pressure sensors on silicon wafers is provided. The diaphragm of the piezoresistive pressure sensors is formed by fusion bonding. The piezoresistive pressure sensors can be formed by silicon deposition, photolithography and etching processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.