Low temperature shape memory thermosetting epoxy, film material and producing method thereof
US9708441B2 · kind B2 · utility
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5Claims
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Key dates
| Filing date | Oct 6, 2014 |
| Grant date | Jul 18, 2017 |
| Priority date | — |
| Expiry date | Nov 19, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/18
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A low temperature shape memory thermosetting epoxy has a epoxy, a curing agent, a modifying material and a functional material. The curing agent is fatty amine, polyamide and aromatic amino compound. The modifying material is polyester polyol, polyether polyol, aromatic diamine, and silicon compound. The functional material is boron trifluoride, terminal carboxyl group, calcium carbonate, pigment, and mixture thereof. Thus, the epoxy is deformable and is shape memorable under room temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.