Method of integrating a temperature sensing element
US9709461B2 · kind B2 · utility
7Cited by
13References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2012 |
| Grant date | Jul 18, 2017 |
| Priority date | — |
| Expiry date | Jul 25, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K2205/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A multi-function sensor includes a body that includes a sensing circuit disposed on a substrate, the sensing circuit including a pressure sensor and a temperature sensor, the temperature sensor being disposed on a flexible portion of the substrate. A method of fabrication and additional embodiments are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.