System configured for integrated communication, MEMS, Processor, and applications using a foundry compatible semiconductor process
US9709509B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 11, 2010 |
| Grant date | Jul 18, 2017 |
| Priority date | — |
| Expiry date | Jul 17, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/0258
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensor processor system is provided on a platform including a semiconductor substrate. The system has multiple integrated subsystems including a micro controller unit provided on one or more first regions of the semiconductor substrate. The subsystems also include an array of programmable memory provided on one or more second regions of the semiconductor substrate, among other elements. The subsystems also include one or more MEMS devices operably coupled to the micro controller unit. In one or more embodiments, an application processor is coupled to the semiconductor substrate and, optionally, a baseband processor is coupled to the semiconductor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.