Forming conductive metal patterns using thiosulfate copolymers
US9709889B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2016 |
| Grant date | Jul 18, 2017 |
| Priority date | — |
| Expiry date | Feb 2, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/405
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A precursor article has a substrate and a polymeric layer having a reactive composition that contains a non-crosslinked thiosulfate copolymer comprising: (a) recurring units comprising pendant thiosulfate groups, and (b) recurring units comprising pendant carboxy, carboxylate, phospho, phosphonate, phosphate, sulfo, sulfonate, or sulfite groups. The (a) recurring units are present in an amount of 1 to 30 mol %, and the (b) recurring units are present in an amount of 70 to 99 mol %. This precursor article can be used to provide a product article comprising a substrate in which the polymeric layer has both exposed regions and non-exposed regions. The exposed regions contain a pattern of electrolessly plated metal within or deposited on the surface of an at least partially crosslinked polymer that has been derived from the non-crosslinked thiosulfate copolymer. The non-exposed regions have none of the electrolessly plated metal or the non-crosslinked thiosulfate polymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.