Treatment of substrate sub-surface
US9710023B2 · kind B2 · utility
5Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2015 |
| Grant date | Jul 18, 2017 |
| Priority date | — |
| Expiry date | Aug 31, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/1688
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Perforated structures and methods for forming perforated structures are disclosed. The perforated structures include partial holes or blind-holes that pass partially through the substrate. The partial holes can be positioned proximate to through-holes that pass entirely through the substrate. The partial holes add mechanical strength to the perforated substrate. Described are methods for modifying the optical appearance of the partial holes such that the partial holes appear indistinguishable from the through-holes, which allows for flexibility in designing cosmetically appealing patterns within the perforated structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.