Computing device heat management
US9710026B2 · kind B2 · utility
3Cited by
7References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2014 |
| Grant date | Jul 18, 2017 |
| Priority date | — |
| Expiry date | Sep 22, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20136
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The description relates to computing devices, such as mobile computing devices. One example can include a housing containing a processor. This example can also include a transition component configured to automatically change a distance between the processor and a proximate region of the housing based upon a state of the processor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.