Semiconductor device, method of manufacturing the same, and electronic device
US9711433B2 · kind B2 · utility
8Cited by
8References
12Claims
0Family size
Assignee
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Key dates
| Filing date | Nov 3, 2015 |
| Grant date | Jul 18, 2017 |
| Priority date | — |
| Expiry date | Nov 3, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes: a first semiconductor element; a first substrate provided on the first semiconductor element and including a cavity with reduced pressure; coolant held inside the cavity; a second semiconductor element provided on the first substrate; and a heat spreading member thermally connected to the first substrate and provided with a hole communicated with the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.