Magnetic alignment for flip chip microelectronic devices
US9711443B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2015 |
| Grant date | Jul 18, 2017 |
| Priority date | — |
| Expiry date | Nov 14, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Incorporating at least one magnetic alignment structure on a microelectronic device and incorporating at least one alignment coil within a microelectronic substrate, wherein the alignment coil may be powered to form a magnetic field to attract the magnetic alignment structure, thereby aligning the microelectronic device to the microelectronic substrate. After alignment, the microelectronic device may be electrically attached to the substrate. Embodiments may include additionally incorporating an alignment detection coil within the microelectronic substrate, wherein the alignment detection coil may be powered to form a magnetic field to detect variations in the magnetic field generated by the alignment coil in order verify the alignment of the microelectronic device to the microelectronic substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.