Integrated optical sensor and methods for manufacturing and using the same
US9711493B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 23, 2014 |
| Grant date | Jul 18, 2017 |
| Priority date | — |
| Expiry date | Aug 20, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An integrated optical sensor and methods for forming and using the same is provided. The integrated optical sensor comprising: a light source; a transparent substrate, having a first surface and a second surface opposite to each other; a first pixel cell array region, located on the first surface and adapted to receiving lights emitted from the light source and reflected by an external object; a second pixel cell array region, located on the first surface and adapted to receiving lights emitted from the light source and reflected by the fingerprint; and a third pixel cell array region, located on the first surface and adapted to receiving visible lights from outside. The integrated optical sensor has simplified structures, the forming method thereof has improved processes, and the using method thereof has more applications. Besides, production costs may be reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.