Optoelectronic modules having a silicon substrate, and fabrication methods for such modules
US9711552B2 · kind B2 · utility
3Cited by
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9Claims
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Key dates
| Filing date | Aug 11, 2015 |
| Grant date | Jul 18, 2017 |
| Priority date | — |
| Expiry date | Aug 11, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/8053
Abstract
Optoelectronic modules include a silicon substrate in which or on which there is an optoelectronic device. An optics assembly is disposed over the optoelectronic device, and a spacer separates the silicon substrate from the optics assembly. Methods of fabricating such modules also are described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.