Terminal connection structure and semiconductor apparatus
US9711884B2 · kind B2 · utility
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4Claims
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Key dates
| Filing date | Jan 19, 2015 |
| Grant date | Jul 18, 2017 |
| Priority date | — |
| Expiry date | Jan 19, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/777
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A terminal connection structure includes a male terminal; and a female terminal having an elasticity and configured to have the male terminal fitted therein such that the female terminal sandwiches the male terminal from opposite sides; wherein the male includes a base material, a first primary coat coated on the base material, a second primary coat coated on the first primary coat, and a surface layer coated on the second primary coat, and the first primary coat and the second primary coat have different hardnesses.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.