Method for producing a circuit board
US9713248B2 · kind B2 · utility
6Cited by
1References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 21, 2015 |
| Grant date | Jul 18, 2017 |
| Priority date | — |
| Expiry date | Jan 21, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Method for the manufacture of a printed circuit board with at least one cavity for the accommodation of an electronic component, wherein the cavity walls exhibit a reflective, in particular mirrored reflector layer characterized by the following steps:Provision of a printed circuit board,Application of a temporary protective layer onto at least a section of the surface of the circuit board,Creation of the cavity by way of penetration of the protective layer in the region of the cavity,Application of the reflector layer,Removal of the temporary protective layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.