Ceramic insulator for electronic packaging and method for fabricating the same
US9713252B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2016 |
| Grant date | Jul 18, 2017 |
| Priority date | — |
| Expiry date | Apr 29, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10303
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention discloses a ceramic insulator for electronic packaging and a method for fabricating the same, and relates to a technical field of outer shell packaging of electronic devices. Under the circumstance of using neither a chemical coating nor any bonding wire connection circuit, through a design that builds a electroplated circuit into the ceramic insulator, the method accomplishes coating of a nickel alloy protection layer onto a porcelain by an electroplating method, so that not only quality of a coating layer but also requirement of a complete appearance can be ensured. All circuits of the ceramic insulator fabricated by the aforesaid method can conduct with external circuits, such that the electroplating method can be used to accomplish coating of the nickel alloy layer, after accomplishment of all metal coating, metallization parts on an end surface of the porcelain is removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.