Metal/ceramic bonding substrate and method for producing same
US9713253B2 · kind B2 · utility
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Key dates
| Filing date | Mar 29, 2011 |
| Grant date | Jul 18, 2017 |
| Priority date | — |
| Expiry date | Mar 29, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24942
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A metal/ceramic bonding substrate includes: a ceramic substrate; a metal plate bonded directly to one side of the ceramic substrate; a metal base plate bonded directly to the other side of the ceramic substrate; and a reinforcing member having a higher strength than that of the metal base plate, the reinforcing member being arranged so as to extend from one of both end faces of the metal base plate to the other end face thereof without interrupting that the metal base plate extends between a bonded surface of the metal base plate to the ceramic substrate and the opposite surface thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.